Description

Used for bonding, sealing, potting and coating protection of electronic components. The potting adhesive belongs to liquid before curing and has fluidity. The viscosity of the sealant varies according to the material, performance and production process of the product. The potting adhesive can realize its use value only after it is completely cured. After curing, it can play the role of waterproof and moisture-proof, dust-proof, insulation, heat conduction, confidentiality, anti-corrosion, temperature resistance and shock resistance. It can strengthen the integrity of electronic devices and improve the resistance to external shocks and vibrations; Improve the insulation between internal components and lines, which is conducive to the miniaturization and lightweight of devices; Avoid direct exposure of components and circuits, and improve the waterproof and moisture-proof performance of components.

Keywords:

Related products

Message

Submit
%{tishi_zhanwei}%